Dr. Krammer Olivér OData support

Department of Electronics Technology

Tags

3D automatic solder paste inspection machine (1) · accelareted life testing (1) · accelerated lifetime test (1) · Ag3Sn (2) · AOI (1) · ball bond (2) · BGA (2) · bondability (1) · brain electrode (1) · ceramic substrate (1) · characteristic lifetime (1) · comparison of tencils (1) · conductive adhesive (1) · convection reflow soldering (1) · cooling rate (1) · copper peel strength (1) · copper wire bonding (1) · crack (1) · cross-sectioning (1) · CT (1) · curing (2) · DC motor control (1) · design of experiments (1) · destructive mechanical tests (1) · digital force measurment (1) · direct current motor (1) · electrochemical impedance spectroscopy (1) · electronic manufacturing (1) · ENEPIG (1) · ENIG (1) · expected lifetime (1) · finite element method (1) · firing time (1) · flexible substrate (1) · flip-chip (1) · Fluid simulation (1) · forced convection soldering (1) · galvanic isolation (1) · HAST (1) · heating factor (1) · high temperature life-time test (1) · hole filling (1) · image processing (1) · immersion silver (1) · infrared reflow soldering (1) · intermetallic compound (1) · intermetallic layer (4) · intermetallic layer growth (1) · isotropic (1) · isotropic conductive adhesive (1) · leaded and lead-free solder alloys (1) · lead-free solder (1) · LGA (2) · liquid surface model (1) · liquid surface modelling (1) · Matlab (1) · mechanical investigation (1) · mechanical modelling (1) · mechanical properties (1) · micro wire bonding (1) · micro-alloyed solders (1) · micro-alloying (2) · microcontroller control (1) · microcontroller programming (1) · miniwave (1) · NeuroMEMS (1) · numeric simulation (1) · parameter optimization (1) · particle structure (1) · Pin-in-Paste (1) · PiP (1) · placement position offsets (1) · platings (1) · Printed circuit board (1) · printing property (1) · production of stencils (1) · QFN package (1) · quantitve metallography (2) · reflow soldering (4) · reliability (2) · reliability inspection (1) · Reliability investigation (1) · resistance (1) · resistance measurement (1) · rheological (1) · rheology (1) · scanning electron microscope (1) · shear strength (5) · shear strength measurement (1) · shear test (1) · silver content (1) · Sn3.5Ag (1) · solder alloys (1) · solder joint (2) · solder paste (2) · solder profile (1) · soldered joints (1) · soldering (4) · stationary state (1) · stencil printing (4) · structure of stencils (1) · Surface Evolver (2) · termosonic bonding (1) · testing of stencils (1) · thermal shock (3) · thermosonic (1) · thermosonic wire bonding (1) · thermosonic wire-bonding (1) · thick-film (1) · thixotropic behaviour (1) · tombstone-effect (2) · ultrasonic (1) · ultrasonic chip bonding technology (1) · vapor phase soldering (1) · vapour phase soldering (5) · viscosity (2) · volume calculation (1) · wedge bond (1) · wetting balance (1)

Theses

35 theses in total.  View all theses »

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