Soldering plays a vital role in assembling printed circuit boards (PCB-s). Probably this is the most important part of the process due to the possibility of several faults during the process. In my research, I give a quick overview of the reflow soldering. During my work, I used a vapor phase reflow soldering oven, therefore I make an outlook to the physical phenomenon of heat transfer, and also give a detailed description of the technology of vapor phase soldering. As my measurements are conducted via temperature monitoring, I write about the different methods of the thermal monitoring possibilities. The main goal of my MSc thesis was to show whether the shadowing effect exists or not when using vapor reflow soldering, so I did research in the topic of the shadowing too.
During my work, I created a detailed experimental for revealing the shadowing effect. As part of this process, I did a research on the market of large electronic components. I suggested several test setups, one of which I realized. I placed large components on FR4 boards into different positions, and analysed the temperature curves on the four sides next to and inside each component.
While evaluating my measurements, I gained experience in processing large data sets and drawing the right conclusions. Based on my findings I make a recommendation on how to improve the test setup and the measurement process to get results easier to evaluate, also for examination of the effects of vapor phase soldering on large electronic components.