Investigating the solder joints of biodegradable circuit substrates

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Supervisor:
Hajdu István
Department of Electronics Technology

This thesis investigates the solder joints of biodegradable circuit substrates. The goal of the work is to study the currently not industry-wide known properties of the environmentally friendly circuit substrates due to the extension of the knowledge with respect to this.

The dissertation summarizes the basics of mathematical and mechanical of statics especially in regard of the elementary principles of shear. Characteristics of linear and non-linear modeling with related material models are presented.

The thesis reviews the finite element method, its usages, practical applications and benefits. A simulation model using these methods was created.

The design and implementation of a test network based on biodegradable circuit substrates was the first part of the technical work. The examination of the biodegradable materials was followed by the lamination, solder pasting and the implantation of resistors. The quality of these steps were rated.

This paper details the shear strength of the soldered joints of the surface mounted parts. Statistics based on the quality ratings are presented.

The final part of the thesis reveals the correlations between shear strength, surface purity, solder paste coverage and the quality of soldering.

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