Nowadays industrial electronic applications already use passive SMD components with 0201 size code, which dimensions are in the sub-millimetre scale. With such small sizes, critical failure sources that were not negligible in certain circumstances yet so far, like critical current density that can cause electromigration, or the presence of the intermetallic compound in solder joints become more and more relevant. The physical measurement of these phenomenons with classic means or methods is very hard if not impossible at all, so we have to turn to simulation methods. With the assistance of computer based simulations and the use of numeric methods, we can analyze the model of a real geometric structure in a virtual workspace. We can calculate the desired aspect of the model with easily adjustable input parameters.
There isn’t much information and only a few simulation based results on these subjects in scientific literature, and if there is, that is mostly for bump solder joints because of the simpler, rotationally symmetric geometry.
In this thesis, I present the methods of computer based FEM simulations, summarize the significant literature in the topic, then i do my own examinations, based on my solder joint models of 0201, 0402 and 0603 sized components. After obtaining general knowledge on the chosen simulation software and its capabilities, I will start a research for optimal mesh parameters with which I can get acceptable results without exceeding the available computing powers. I have to define analysis and validation methods for this purpose, then based on these I have to do an examination in order to determine optimal mesh parameters which i can later use in my main research, because this could be one key for obtaining proper results at the end.