Soldering, during which the mechanical and galvanic contact is established, is one of the main key features in the mounting technology of electrical appliances.
The quality of the solder joints are extremely important parameter of the reliability of the assembly, however, no standardized method is usually applied in order to classify the quality of the solders. A previously developed method is capable of generating a quantitative parameter for the characterization of the lead-free solder based on electrochemical techniques.
In my thesis work I have analyzed the individual steps of the above mentioned methods and I summarized all the necessary requirements of a device which might be able to perform such measurements.
Commercial appliances were analyzed, whether they are capable of performing these special measurements. Controlled experiments were carried out in order to determine the capabilities of a dedicated instrument based on an electrochemical integrated circuit. Based on the experiences the complete list of specification and operation modes were compiled for a dedicated custom made instrument.
Samples soldered by lead-free solder alloy were prepared and they were inspected both with classical metallographic and new electrochemical methods. The specification of the prototype of the designed hardware was systematically verified by experiments which were cross-checked with control experiments performed by calibrated laboratory equipment.