In my thesis will be presented in the micro-electronics industry used welding technologies, especially the laserbeam- and the resistance- microwelding. I make the laser beam welded joints between 0.5 mm2 diameter, copper-based, multiple fiber lines and 0.2 mm thick copper-based connections.
For the micro-welding 1064 nm wavelength, pulse, Nd: YAG laser source device and a programmable optical focusing unit (Trumpf TruPulse 103 - Trumpf PFO-20) were used. The optimization of the welding parameters during the series of experiments by varying the spot diameter of the laser beam in real time by moving the laser beam and by varying the effective performance achieved. I analysed the finished joints with non-destructive (stereomicroscopy) and destructive methods (metalmicroscopy, electron microscop - EDS composition test, microhardness, average grain size).
The test results are compared to the current manufacturing technology (resistance -microwelding). After the testing and evaluation of the results, I propose the following comparison of laser welding technology in production. The application microwelding induce or further develop the present binding techniques.