The mounting of the specimen is a highly important step during the metallographic preparations. The most popular method nowadays is embedding the specimens in synthetic resins. During my research I carried out literature study on the pros and cons of the most commonly used mounting methods and mounting resins used in the electronics industry. Particular attention was paid to the properties of the epoxy resins.
During my thesis work I searched for solution to the problems, that can occur during the curing of epoxy resins. Trough experiments I familiarized myself with the cross-linking process of the resin. Based on theses experiments, I found that during the cross-linking process of larger amounts of epoxy there is an excessive amounts of heat generation which can raise the temperature of the specimen, and the mounting resin as well. This high temperature can damage the specimen and spoil the quality of the embedding which can make the following specimen preparation steps and the microscopic investigations very difficult, if not impossible.
The main goal of this work was to develop a method which can help conduct the excessive amounts of heat during the cross-linking process.