Use of a flexible circuit carrier for 3D circuit design

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Dr. Berényi Richárd
Department of Electronics Technology

Recently, due to the fast development of electronic industry, a clear trend is noticeable towards smaller packages and higher densities. More effort has been made to take advantage of the vertical direction of space during the construction of different kind of electrical devices. While conventional 3D designing has a lot of advantages, their full potencial has yet to be realized. This is due mainly to the difficulties of 3D designing software. To overcome these limitations various techniques has been developed, for example the so called laser micromachining. This method is based on bending technology and uses flexible circuit carrier. The design can be done in 2D then bending it to a 3D object. The flexible and flex-rigid circuits has been spread widely and can be found in almost all of our electrical devices. One of the main advantage of flexible circuits that they can be shaped into any three dimensional form and the laser micromachining can improve this attribute further.

In my thesis work my goal is to design a flexible circuit in 2D that can be formed into a 3D shape with the help of laser micromachining. The flexible circuit implements a six-sided dice and informs the user about the value through wireless communication and LED flashing.


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