Improving the soldering experiments on biodegradable circuit boards

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Dr. Géczy Attila
Department of Electronics Technology

Handling electronic waste is an ever increasing problem in today’s world. Since this waste contains many poisonous materials, our environment is at more and more serious risk due to the increasing number of electronic devices. Some of these problems can be solved using cheap, biodegradable ingredients to produce low quality circuits.

In my thesis I became familiar with the maintenance of electronic waste, technical terms related to biodegradable materials, their main uses and producers. I also got to know biodegradable materials such as polylactic and cellulose acetate. I learned about surface mount technologies and vapour phase soldering and low melting point welding paste. The aim of my thesis is to produce fusions, examine and evaluate these fusions, and compare their results. During my practice work I had a look at examinations of softening and became familiar with the sample transportation apparatus, its hardware and software solutions. My main aim is to apply welding paste using stencil printing while following the steps of surface maintenance technology on FR4 and biodegradable boards, the implementation of components and the welding itself. The completed welded fusions have been examined using optic microscope, x-ray machine, electronmicroscope and cross-section and mechanic evaluation of the fusions using thrust measurements. Making conclusion based on the results of these tests and researching the reasons of any faults. Finally comparing the results of FR4 and biodegradable boards.


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