Metallography, nowadays also called materialography, does not only serve the analysis of metals. Complex structures (such as electronic or micro-electronic devices) are also inspected by its methods. Materials of these structures often have different mechanical properties which makes materialography a separate discipline. Even though dozens of technologies (methods, materials) are available commercially in our days, one who deals with metalography faces a difficult problem when the right procedures need to be determined for a new sample type. There are many recipes in the literature but finally all samples show up different from the earlier studied ones and the methods have to be redefined in an experimental way to obtain the best possible result. This thesis work presents my studies on the optimization process of cross-sectioning of electronic samples, especially concentrating on the solder joints. The work included the deep study of the related literature, design of experiments and test samples, preparation of the samples and their analysis by optical microscopy. The main goal of this work was to obtain optimized process parameters for sample preparation so that the analysis of the solder microstructure, intermetallic compounds and particle boundaries became possible without a Scanning Electron Microscope.