Investigation of solder joints with electromagnetic simulations

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Supervisor:
Dr. Géczy Attila
Department of Electronics Technology

Nowadays it is a common fact that printed circuit board fabrication companies can routinely build boards with trace widths of 4 mils (0.1016 mm). With the evolution of the electronic industry, passive chip-size components with size codes of 0603, 0402, 0201 are common as well and the dimensions of these passive components are less than a millimeter. In this size range, the appearance of certain problems that affect electrical and mechanical behaviour (as the effect of inter-metallic compounds and the electromigration) are getting more and more significant. These problems are hard to measure with ordinary measurement methods, or literaly impossible, so we have to use simulation methods. We can use computer based simulation and numerical methods, where we can easily set the environmental and input values to analyze the constructed model of the real geometry in a virtual workspace.

With this BSc tesis work, I evaluate the choosen software and observe if it could manage the highly variable order of magnitudes, such as for example the very thin inter-metallic compound and the much bigger solder volume, and to get results to decide if further research and analysises were necessary and reasonable.

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