For writing my thesis, I started with investigating the relevant literature on electronic and soldering technologies. During this process, I studied the appropriate standards. In this way, I got acquainted with the specifications of the fields in concern. Additionally, I investigated literature in order to learn how voids and intermetallic layers are formed as well as their effects on the solder joints.
It was followed by the design and implementation of experiments, which helped me get the pictures that were necessary for the investigation.
It was very important to get samples, which contained voids and intermetallic layers in large quantities. More algorithms for image analysis were then made. These algorithms investigated the main parameters of the phenomena, which were generated during the soldering.
When measuring the rate of voids and bumps, the results I got were contradictory to the expectations. I was expecting to get a quite similar result in investigating the rate of voids and bumps when I measure them with the help of an x-ray image and cross section image. Instead, very different results were received during the two measurement methods.
In the further part of my thesis, I measured how the size of voids changes with the different cross section levels. During this experiment I experienced that the different positions of the cross section can greatly influence what we can see in the images.