Simulations of Nanoparticle based Integrated inductance to FR! substrate

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Dr. Berényi Richárd
Department of Electronics Technology

Coils are used in a very wide range of electronic devices, BAY-ATI and BME ETT have a completely new idea to create a big inductivity with planar technology.The main point is to make an embedded iron core in FR4 carrier, which is covered with a thin gold wire. I would like to build a simulation model.

First of all I used Comsol Multiphysics software to created the geometry for the simulation. During that, there where a lot of problems to solve. After that I had to add the „real” physical parameters to the model. I used plently of simplification: phisical approximations, geometrical symmetries and so on. The last part of the model before we can run the simulation is the meshing, there are also a lot of trick i had to use.

Theories are beautiful things, but sometimes not match to the reality, thats why after the sumulations I made some measuring on a real device.

At the end I compared the results, which are came form the simulations, analytic calculations and measurments. The results of the simulation and the analytic calculations are much closer to each other, than the measured value of two device which created with the „same” technological parameters.

The final solution is that, we have to improve the technology.


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