The open copper surfaces grow a thick oxide layer just over a few days even at room temperature. In order to prevent this, the soldered surfaces of the printed circuit boards are provided with surface coatings during manufacture.
As part of my research I studied the available literature into how the different selective coatings are prepared, properties and the testing procedures that are used to measure the effectiveness of these coatings.
One of these types of coatings is called is the immersion silver method. One of the most essential components of this method is the silver electrolyte bath, the parameters of which have a significant influence on the quality of the coating produced.
In my thesis I am comparing samples treated by various aged electrolyte baths using a test circuit panel, examining the test results for solderability.
After evaluating the test results, I make recommendations on improving the aged electrolyte bath, which ensures and preserves the coating for solderability.