Investigating the Curing of Isotropic Conductive Adhesives with Infrared and Vapour Phase Method

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Supervisor:
Dr. Krammer Olivér
Department of Electronics Technology

Investigating the Curing of Isotropic Conductive Adhesives with Infrared and Vapour Phase Method

Abstract

Electrically conductive adhesives were used first in the middle of the 20th century. Their distribution only began in the 80s, therefore the technology is not yet mature, and many question arise about the applicability. For example, how conductive adhesives behave in certain environmental conditions, how the properties change over time, how the different heat treatments affect the reliability of the curing. I try to answer these questions, with closer investigation on the technology.

In this semester I have researched the literature of this issue, and to gather more information about the vapor phase soldering, isotropic conductive adhesives, their composition, the method of dispensing to the surface, and their curing. I study the positive and negative attributes of the conductive adhesives, that can help or inhibit the wider spread of their application. I have also collected the industry applications of the conductive adhesives. I summarized the researches, measurements and the conclusions.

According to the researches, conductive adhesives can be a suitable replacement for the conventional solder paste, but the technology is not yet in a mature state, so there is a need for tests and experiments for proper application.

The conductive adhesives can not compete with solder in bonding strength, and in heat- and moisture tolerance. However the conductive adhesives have a lot of beneficial properties, for example flexibility or curing in a wide temperature range. In the following part of my thesis work I will examine these properties with a specially fabricated test panel.

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