Nowadays the electronic industry sets quite a pace of continuous investment for the members of the sector. Firms not only have to maximize profit but they must also keep their customers circle and constantly lure more. Most of this can be achieved through minimizing costs which is today done by the modern tool of computer aided production planning. Knowing the information on supplies, production parameters and delivery, this production system can optimize orders, manufacturing processes and shipments while keeping up the quality standard. Written on the request of Lightware Vetítéstechnikai Kft, my thesis had the objectives of summing up opportunities for optimization, giving proposals on how to increase profit and introducing technologies to filter out rejected materials earlier or to reduce their initial quantity. I was looking for new methods and layouts with which costs can be cut down, quality of the production can be sustained and rejection can be limited or restricted to the subassemblies after error detection. First I had to have an overview on the different fields of production planning at Lightware Kft. Then I got acquainted with the internal processes by following the production of one product. Thus after fully understanding the procedure I could point out errors and by improving the test-phases of the production, these errors can now be detected much earlier and corrected cheaper than before. For this purpose I created a workstation to inspect every subassembly before finalization. After understanding the general production related errors, I have encountered a problem caused by the soldering process. For that I have given a cheap and simple solution by modifying the silkscreens. This gives an obvious description right on the PCB about what temperature or power is needed for soldering different components. I have also provided a detailed instruction list for these soldering tasks. Later I inspected the products that were sent back to the company within warranty period. By knowing the manufacturing process I was able to analyze the problems which could be described by one of the following causes:
- inappropriate usage, failing to keeping the instructions, users’ responsibility,
- built-in component did not comply with the quality standard,
- inadequate test procedures or wrong implementation of them,
- mechanical damages caused by delivery.