Development of an experimental vapour phase soldering station

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Supervisor:
Dr. Géczy Attila
Department of Electronics Technology

The Vapour Phase Soldering is a promising technology in the industry, considered as an alternative of the classical infra- and convection heat transfer technologies for reflow soldering. The reason of the industry’s interest is mainly the sensitive soldering of components and the high heat capacity differences occurred in power electronics, but the method is also coming into the highlight because of the Galden fluid, and the possibility of controlled parameter settings, by which high quality solder joints can be created.

This thesis is based on departmental research. During my work I participated in the software and hardware unit development of an experimental vapour phase soldering station with motorized sample holder; the control of the holder is based on active temperature measurement feedback.

During the topic of my thesis I present the vapour phase soldering technology with its advantages and disadvantages. Then I present the vapour phase soldering solutions found in the industry. At the end of the literature review I present the operation and applicability of the stepper motors which necessary for the movement.

Details of the complete hardware system are also described. Some parts of the system are earlier results of development while others are produced by National Instruments with a focus on additional hardware element developed by myself. In the description a special emphasis is given to the driver installation and the initialization of the hardware components and also the installation and configuration of the LabVIEW development system itself.

I describe the LabVIEW development system and the areas in which it has advantages over other programming methods and solutions. Next I discuss in deatails the operation of the developed software and also the backgrounds of the solutions and used design patterns. The testing of the completed software will be also presented. With this method a given soldering profile can be followed with minimum error, which compared to industrial solutions, provides a unique opportunity to produce outstanding quality solder joints. 

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