Investigation of Experimental Thermal Profiles During Vapour Phase Soldering

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Dr. Géczy Attila
Department of Electronics Technology

With my work, I joined the current experiments on the department, related to Vapour Phase Soldering. In the beginning, I met the process in the form of literature review and then started working with the previously developed experimental vapour phase equipment. My work continued the experiments related to the Soft Vapour Phase Soldering technology, where the heat transfer is controlled precisely, in order create sophisticated thermal profiles. My goal was to create custom thermal profiles, which should follow the profile recommended by the manufacturer of the solder paste. Five types of thermal profiles have been created. Three of them by using manual control, and two, by using a novel automatic control system. By programming the control system, the thermal profile recommended by the manufacturer can be achieved. For the experiment, Galden HT170 fluid was used, with which the department had limited experience. By following the steps of surface mount technology, 0603 resistors were soldered to test boards’ contact surfaces, using different thermal profiles. During my further investigations, I have set a goal to verify the improvement of the soldering quality with the more precise profile setting. The created solder joints were examined with both destructive and non-destructive methods. The test results were processed and compared to each other. As a result of the experiments it becomes apparent, that by adjusting the height of the solder sample in the unsaturated vapour filled chamber, sophisticated thermal profiles can be achieved, leading to high quality solder joints. The more sophisticated profiles lead to higher quality joints. Similar quality of solder joints can be created with both manual and automatic control, but because of ease and precise reproducibility, automatic control is recommended.


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