Production of environmentally friendly circuit substrates

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Hajdu István
Department of Electronics Technology

Over the past three-four decades the electrical industry went through large and rapid development. Many new devices and inventions became available, which means the society on daily basis is motivated with variety of electronic devices. The growth and expansion of the improvements has not stopped till this day, therefore the number of devices are still increasing year to year. Unfortunately, this increase has an impact on the waste quantity, too. In case of electronic waste, we talk about number of non-polluting and non-recyclable materials. Since those materials has a pollutant effect on the environment, the industry introduced more restrictions and stringer rules for the manufacturing processes and material composition. In order to comply with pollution reduction and rules, manufacturers are also forced for recycling processes for a higher degree of environmental protection.

Therefore, in my dissertation project I focused on the production of biodegradable circuit substrates and for a developmental progress I performed various tests on them.

During the first part of this research I studied the composition of the daily waste and I introduced the basic concepts related to the topic and materials. Thereafter, I presented the processing forms of printed wiring boards and recycling possibilities of polymers.In the next chapter, biodegradable polymers and their possible application has been discussed. In 2010, Department of Electrical Technology commenced an initiative act, in which they concentrate on the production of the biodegradable biopolymers and the implementation of the investigated studies. With my work I joined to this initiation. Hereinafter, I introduced the similar raw material production and technologies to support the fabrication of boards. Especially three main materials, polylactic acid (PLA), cellulose acetate (CA) and bioepoxy (GPTE-DETDA) has been used for produced test boards with the help of Polymer Engineering Department. The test boards were subjected to various mechanical tests, such as the bending test and tensile strength measurements. After all, the mechanical investigation was followed by the different ways of copper layer application.

The results have been compared with the most commonly used printed wiring board material the FR4.

On the investigated boards the Department has made prototyped circuits (RFID, MP3 players) and luckily their operability has been testified.


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