Study of environmentally friendly circuit substrates

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Hajdu István
Department of Electronics Technology

In the first part of my thesis I measured the mechanical parameters of biologically degradable enviromental friendly polymer carriers, before and after two stress tests namely: Temperature, Humidity and Bias (THB) and Highly Accelerated Stress Test (HAST). I conducted the measurements on polylactic acid (PLA) and cellulose acetate (CA). The measured mechanical properties were the following: surface hardness, flexural strength performed with the help of Polimertechnikai Tanszék and surface roughness performed with the help of Elektronikai Technológiai Tanszék. Comparing the before and after results i got numerical data of the degrading effect of the two stress test on the enviromental friendly polymer. With another test series I measured the water absorbation of PLA, CA, and FR-4 sample (which is critical for electronical carriers) with a longer THB stress with the help of Elektronikai Technológiai Tanszék. Then i measure the modulus of elasticity on different raised temperature levels with the help of Polimertechnikai Tanszék because of the polymer’s heat sensitivity. In the second part of my thesis I conducted a literature research about enviromental friendly bio based epoxy resins. I got to know the currently used and researched vegetable oil based epoxy resins with all their advantages and disadvantages. I also presented a research which also tried to make and test a completly enviromental friendly circuit board. In the end thanks to Niedermann Péter from Polimertechnikai Tanszék, I also got to test measure and compare (with the previously mentioned biopolymers) a sugar based epoxy. In the end of my thesis I also measured and compared some of the more important electrical paramteres (surface resistance) of the two biopolymers, FR-4 and sugar based epoxy.


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