In my thesis I reviewed the solderability of the carriers made from biopolymer materials which are getting higher and higher importance these days and I looked over the changes of the plastics caused by temperature. In addition to the geometric deformation, I measured the changes of the surface hardness and the surface roughness. I set up a measurement to monitoring the thermal profiles, and made experiments in the vapour phase equipment on lower (150°C) and higher (240°C) temperatures. The cellulose acetate and the polylactic acid already had measurable deformation during the lower temperature soldering. The bioepoxy without the laminated conductive layer didn’t suffer any deformation in the higher temperature vapour. After laminating, drilling and cutting appeared hairline crackes in the material, which became the starting place of the delamination. However the prepared test circuits sustained the soldering with heat gun. The metallization of the examined holes are good, those are suitable for the Pin-in-Paste technology.