Investigation of high TCE PCB substrates

OData support
Supervisor:
Dr. Gál László
Department of Electronics Technology

Abstract

Today, the development of printed wiring boards is very important to the industry. The rapid development and integrity of functions requires carriers to align the components. However, this is not an easy task, since the miniaturization necessarily implies the dissipation per unit area increases.

The first big chapter of my dissertation deals in detail with the currently used conventional and modern, improved presentation of printed wiring boards. This included the important properties of the plates are listed. There are chapter comparative tables in the end of this chapter.

The second major section presents in detail the technological steps of conventional resin-based carriers, describes the problems encountered during operations and discussing them in detail. The chapter is divided into three sub-heading, each step belongs to one of three categories, which are: mechanical-, photolithography- and wet chemical processing.

The third - and last - large section presents a comparative thermal measurement between FR-4, CEM-3T and Aluminium substrates. The chapter begins with a short theoretical summary, then it's followed by presentation of the measurement arrangement. Finally, there are evaluation of the measurement results and conclusions in the end of the dissertation.

The study shows that the heat transfer of FR-4 and CEM-3T plates are practically identical, and the thermal conductivity of Aluminum is approximately six times higher than the previous ones.

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