During the writing of my thesis at Hitelap Zrt., I have examined the
manufacturing possibilities of flex-rigid printed circuit boards, examined the boundaries
of technology, and studied the deviations from the manufacturing of traditional multilayer
I traced bibliographical for the different kinds of widely used constructions and
their solutions in industry.
I designed the operational step sequence of a construction of a chosen type (simmetrical multiflex construction),
examined the technological boundaries, and steps which are not to be found in the
manufacturing sequence of a traditional multi-layer board.
I determined the materials, which are used in rigid-flex technology, but are not
used in simple rigid multi-layer boards.
I designed a printed circuit board, which can be used to demonstrate the defects
of production, like layer structure, feasible minimum thinnest track width, appropriate formation of through hole plating.
Finally I examined the board with electrical testing.