Abstract Since the dawn of integrated circuit (IC) technology, the number of electronic components and heat dissipation per unit surface is rapidly increasing. Although heat dissipation of the components decreases with size, transport of the heat generated in ICs poses a serious technological challenge and is a limiting factor in increasing computational capacity.
Abstract One of the most promising solutions to the problem are microchannel coolers. The main idea behind them is to get the coolant close to where heat is dissipated, so channels are created in the silicon chip on which the ICs are created. Since the mass flow of the coolant is limited, finding favorable channel geometries is crucial to increasing cooling efficiency.
Abstract In this work, after reviewing the theory of thermal phenomena, analytical, numerical and experimental results are presented concerning an already fabricated microchannel cooler, in addition to numerical results for a cooler currently under manufacturing. The effect of turbulence and additional terms on the thermal resistance are examined. In addition, the influence of channel patterns (straight, zigzag, funnel) on the thermal resistance of a simpler, single channel system is investigated, in addition to material substitutions increasing the effective heat transfer surface. The practical circumstances of the usage of microchannel coolers are discussed.