Today, wire bonds make up a significant part of electrical connections, and the need for increased reliability continuously grows. Using the traditional methods, it is not possible to complete a 100% quality control, therefore I will examine technologies that could satisfy this growing need.
During my work, I have studied technologies that promise to provide a solution, focusing on electrical measurement methods that can predict the quality of the bonds and detect errors during the wire bonding process.
In my research, I discuss different technologies that represent some parts of this effort, but it is obvious, that there is not one method that is spread and widely used in the industry.
This is mainly due to the limited applicability of currently existing technologies, as well as the continuous development an improvement of these methods, which currently makes it unlikely for one method to become widespread, such as bond pull tests did.
One connection point of some the different technologies is measuring the electrical properties of the ultrasonic transducer, and forecasting the bond quality by comparing the measured data to patterns obtained earlier. The Hesse & Knipps PiQC technology measures multiple mechanical parameters, thus provides a great insight into the process, and can help predict bonding quality and the type of error that may occur.
These two different approaches could provide a basis for further development of similar technologies, and enable the possibility of the development of a method that could be widely spread and used in the industry.