In this thesis my task was to create a technological line for the nanostructuring of the alumina thin film layers, which allows the structuring of the layer under the alumina layer. For this, I made extended and preliminary experiments on two different stocks (aluminum thin films detached on silicon wafers and aluminum foils). Before the first step of the experiments, I had to build an experimental assembly for electrochemical polishing because of the roughness of the aluminum surface. The main part of the line was when the porous alumina formed. I used two different electrolytes for this process: a 5 wt% oxalic acid for the alumina foils, and a 20 wt% sulfuric acid for the detached aluminum layers. The technology’s critical process is the dissolution of the barrier layer with a 5 wt% phosphoric acid. For this step I had to design and fabricate a special two-half permeation cell. There was a separated experiment to testing the fill of the pores with electroplated nickel. At the end, I made some preliminary examination, which revealed that the alumina templates are porous, and the sizes of the electroplated nickel particles are in the submicron scale.