Qualification methods of Hot Air Solder Leveled PCB surface finishes

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Supervisor:
Dr. Gordon Péter Róbert
Department of Electronics Technology

During my research I carried out literature study on the pros and cons of the most commonly used PCB surface finishes used in the electronics industry. Particular attention was paid to the properties of the HASL finishes. I have made a study on the qualification methods of the surface finishes. I have grouped and described these methods to the extent necessary for my work. I have designed a test panel with special layouts to compare the qualification methods. These special layouts were planned in a way to help the successful and precise execution of the later applied analysis methods. I have also made a study on the technological parameters of the HASL process. Then with the alteration of specially chosen parameters I had the test panels manufactured. Later I have made some experiments and documented the results. After these experiments, I have evaluated and compared the results in order to be able to determine their correlation. Finally by summarizing the pros and cons of the qualification methods I have suggested an analysis method suitable for the industry. I have also made remarks on how to further improve these qualification methods.

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