Comparing different methods of through-hole plating of printed wiring boards

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Supervisor:
Pinkola János Dr.
Department of Electronics Technology

Comparing different methods of through-hole plating

of printed wiring boards

The thesis investigates different technologies of through-hole plating in accordance with the published guidelines. It offers a brief view of the professional factual knowledge, emphasising the demonstration of MacDermid Black Hole HT and Rohm & Haas Circuposit 3000 electroless copper technologies. The consequences of the survey have been made by designing, manufacturing and environmental testing of multilayer printed wiring boards with different hole diameters and testing 50000 holes.

Based on the results of my survey, it can be stated that the holes, which have been plated by electroless copper technology show lower electrical resistance, they are more homogenous and the number of damaged holes is lower as well.

Mechanical - mostly tensile oriented - investigations proved that the plating with the use of Black Hole technology establishes a 30 % weaker mechanical bond with the hole wall than the same with electroless copper technology. The difference has not even decreased during the environmental tests, so based on the samples examined, it can be stated that the electroless copper method provides a better mechanical bond.

In conclusion, based on the sample I have examined, printed wiring boards made with electroless copper show better - though only to a lesser degree - qualities, mechanically and electronically alike.

However, the fact that Black Hole technology is more environment-friendly, cannot be ignored.

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