The aim of this diploma thesis is on one hand to describe the available measurement techniques and methods of electronic PCB’s mechanical / thermomechanical properties, and on the other hand, according to their applicability, to design a working measurement method and layout, which is capable of providing full field strain measurement results even under SMT assembly line thermal / mechanical conditions. The importance of this method is very high as it might be able to reduce or eliminate production failure modes, and this way minimizes financial losses, in addition it would help optimizing technological process parameters.
After the review of theoretical backgrounds of mechanical deformations, the current measurement methods and techniques will be introduced which are available nowadays, highlighting the resistive strain gauges, considering the possibilities and limitations of the technique.
As a possible solution to the above detailed technical challenges, a strain gauge sensor matrix, which can be laminated in the PCB structure’s internal layers will be introduced, including the reasons for the choice and the mapping of applicability and limitations. The justification of the applicability consists of making FEM models and simulations, and further verifications using a properly designed measurement PCB – sensor layout which has undergone several measurements.