Optimizing reflow soldering with measurement approach at industrial environment

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Dr. Géczy Attila
Department of Electronics Technology

Appropriate optimization of workflows plays an important role in electronics technology. The most effective settings to keep the errors low, the main aspect is the productive manufacturing in the industry. The most important expression is the coordinated work of all the machines in the production line, from paste printing, through the component to the soldering.

In my thesis I dealt with the optimization of the heat profile of the reflow oven. My main work was done on the Electrovert OmniES 7 type oven at ARH Zrt. SMT manufacturer line. The primary topic of my literaure research is to present the factors of soldering in the industrial surfaced mount technology production line from the insertion of the panel to the finished product. So I made a brief general description of each step of the production line. In production processes, emphasis was placed on the factors affecting the heat profile of reflow soldering technology, such as the temperature of the solder paste in the heat zones, allowing the heating of the furnace. To measure the temperature, I used a V-M.O.L.E recorder and its software to evaluate the results. Using the software estimation, I tried to create the most appropriate heat profile for the particular paste and circuit. The profile what a made it was created by optimizing the factory previous profile which has very good precision. During the optimization, I changed the temperature of the heating zones and the speed of the air circulating fans on the oven control screen for better results. I followed the changes with continuous monitoring. The final profile was created as a result of numerous measurements, so the completed profile suitable for production based on results. At the factory there are 750 products soldered by my profil while I was there without any mistake. Comparison of new and old profiled products was performed in the department's laboratory. During the comparative experiments, I used optical microscopy, X-ray microscopy and shear force examination. Based on the measurement results, the difference between the two profiles was minimal. There is no significant difference between the two solders based on the X-ray images and the shear force measurements.


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