Production and mount technology of Low Temperature Co-fired Ceramic (LTCC) circuit

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Supervisor:
Dr. Krammer Olivér
Department of Electronics Technology

My thesis is about the production and mount technology of multilayer Low Temperature Co-fired Ceramics and its critical sequences as the via filling and the breaking of plates. I review the literature about the fabrication materials and the steps, especially making vias by mechanical punching and laser drilling, and filling by printing and injection. I checked the base of the statics and the fracture mechanics, principles and observation for experiments, calculation methods for the optimal breaking force and context between the depth of the scribing and breaking force.

In my thesis I examined making and filling of vias. During the tests mechanical hole punching did not lead to suitable results, because slags were remain at the edge of the holes. The holes made by laser were appropriate and I continue the experiments using this method on one and three layer specimens. For laboratories the injection filling technique can be used economically, so I operated with a manual and a pneumatical device. The first method was complicated in preparation, while the other in cleaning. I made the via filling and the other fabrication sequence and I examined the cross polished samples. Both technology gave proper results, however the pneumtaical one was better beacuse of controllability.

As investigating the assembly line of LTCC the dicing and breaking of the ceramic plates were the most critical process so I review the literature and made experiments about it. I tested scribing and laser perforation and their failures at Robert Bosch Electronics Ltd. I measured their settings and broke the specimens by a modified machine. I found correlation between the measures and the breaking forces and made calculations to optimize the process. The deviaton was minimal as the pressure during dicing was 295 kPa the breaking force was 10 N. The failures can be reduced with these settings.

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