Department of Electronics Technology
3D scanning (1) · 8 bit microcontroller (2) · active safety (1) · additive technology (1) · Air quality sensor (1) · airborne dust (1) · Aluminium tape (1) · amg8833 (1) · Android (1) · Android application (4) · ANSYS (1) · arduino (1) · Arduino IDE (2) · arduino mega (1) · Arduino Nano (1) · audio processing (1) · automation (1) · automatisation (1) · automotive electronics (1) · automotive radar (2) · ball grid array (1) · battery charger (1) · BGA (1) · biodegradable (2) · biodegradable materials (4) · biodegradable printed circuit board (5) · biological degradable (1) · biological degradable carrier (1) · biopolimers (1) · biopolymer (2) · Biot number (1) · Bluetooth (1) · button mushroom (2) · Cadsoft Eagle (1) · calibration (1) · capacitive coupler (1) · Circuit analysis (1) · clinometer (1) · cloud computing (1) · component mounting (1) · computer simulation (1) · convection reflow oven (1) · corporate environment (1) · cross-section grinding (1) · current density (5) · current load (1) · Daisy Chain testing (1) · data capture (1) · data collector (1) · datalogger (1) · design flow (1) · DHT22 sensor (1) · Digital Signal Processing (1) · eco-friendly (2) · Edge Computing (1) · electric hot water heater (1) · electrical circuit design (1) · electromigration (3) · electronic manufacturing (1) · eletromigration (1) · embedded system (1) · energy efficient methods (1) · ESP32 (2) · experiment (1) · experimental soldering machine design (1) · Exposed-pad (1) · failure analysis (1) · Fan-Out Wafer-Level Packaging (1) · fault analysis (1) · filmwise condensation (2) · finite element method (2) · finite element simulation (1) · flash memory (1) · flexible printed circuit board (2) · flying probe (1) · FR4 (1) · FR-4 (1) · Galden (1) · gaming console (1) · gas sensor (3) · grid-exe (1) · Hall sensor (1) · hardware design (3) · Hardware development (1) · HDBT (1) · HDMI (1) · heat capacity (1) · heat transfer (2) · heat transfer coefficient (3) · heat-index measurement (1) · heating time (1) · high current density (1) · High-Temperature Solder (1) · humidity measurement (1) · I2C communication (1) · ICT - In Circuit Test (1) · image processing (2) · in-circuit testing (1) · inclination (1) · increased (1) · Industry 4.0 (3) · infrared reflow soldering (2) · infrared soldering (1) · infrared transmission (1) · integrated circuit packaging (1) · intermetallic (1) · intermetallic layer (1) · intermetallic microstructure (1) · Internet of Things (2) · IoT (2) · IoT devices (1) · Kapton tape (1) · kitchen technology (1) · LabVIEW (1) · LCD display (1) · Lean manufacturing (1) · Lean.methods (1) · light sensors (1) · Li-ion (1) · Li-po (1) · LoRaWAN (1) · Machine capability (1) · machine harvesting (1) · machine vision (1) · Matlab (1) · Maxwell (2) · measurability test (1) · measurement accuracy (1) · measurement of surface roughness (1) · measurement technology (1) · measuring card (1) · Mentor (1) · MESH network (1) · microcontroller (1) · microcontroller control (1) · motor control (1) · OpenCV (1) · optical inspection (1) · optimization (1) · PCB (2) · PCB design (5) · PCB designing (1) · PCB desing (1) · PIC microcontroller (1) · PID controller (1) · PLA (1) · PLA/Len (1) · Placement machine (1) · polmers (1) · power electronics (1) · power transfer (1) · Preform (1) · pressure measurement (2) · pressure sensor (2) · Printed circuit board (3) · printed circuit board design (1) · profiling (1) · PWB (1) · PWM (1) · Python (1) · QFN package (1) · QFP package (1) · quality check (1) · quality management (1) · radar (1) · radardetector (1) · raspberry (1) · Raspberry PI (3) · reflow (3) · reflow oven (3) · reflow soldering (8) · resistance measurement (1) · retrofit (1) · RFID (1) · rfm95 (1) · schematic design (2) · sensor (2) · sensor module (1) · sensor station (1) · sensorics (2) · Servo (1) · servomotor (1) · shadowing effect (2) · shear force test (1) · Siemens EDA (1) · simulation (5) · simulation software (1) · skin effect (1) · smart irrigation (1) · Smartlab (1) · SMD adhesive (1) · smd component (1) · SMD jumper resistor (1) · SMT (2) · SMT production (4) · SMT production line (1) · SNES (1) · soft VPS (1) · soil moisture (1) · soildering (1) · solder ball (1) · solder joint (2) · solder joint examination (3) · solder profile (1) · solder profiles (1) · soldering (1) · Sous vide (1) · space enviroment (1) · SPI communication (3) · statistical data analysis (1) · stencil printing (2) · stepper motor (2) · stm32 (1) · subtractive technology (1) · surface mounting (3) · SVP (1) · System Identification (1) · temperature (3) · temperature difference (1) · temperature measurement (4) · temperature profile (1) · temperature sensor (1) · test program (1) · thermal analysis (1) · thermal profile measurement (1) · thermal simulation (1) · thermistor (1) · thermocouple (4) · thermocouple attachment (1) · thermodynamic simulation (1) · thermodynamics (1) · ThingSpeak (1) · TinyML (1) · USB 2.0 (2) · vacuum soldering (1) · Value Stream Mapping (1) · vapor phase soldering (6) · vapour phase soldering (15) · via in pad (2) · voids (2) · volatile organic compounds (2) · VPS (6) · wearable (2) · wireless power transfer (1) · work instructions (1) · WSN network (1) · Xpedition IC Packaging (1) · x-ray image (1)
72 theses in total. View all theses »