Department of Electronics Technology
3D automatic solder paste inspection machine (2) · 3D circuit (1) · 3D file formats (1) · accelareted life testing (1) · accelerated lifetime test (1) · additive technology (1) · Ag3Sn (2) · AOI (1) · artificial intelligence (1) · automatic measuring station (2) · ball bond (2) · ball diameter (1) · BGA (3) · biocomposite (1) · biodegradable electronic substrates (2) · biodegradable printed circuit board (1) · bondability (1) · brain electrode (1) · CAD softwares (1) · capillary imprint (1) · ceramic nanoparticles (1) · ceramic substrate (2) · characteristic lifetime (1) · circuit design (1) · circuit validation (1) · comparison of tencils (1) · computer simulation (1) · computer vision (1) · conductive adhesive (1) · convection reflow soldering (1) · cooling rate (1) · copper peel strength (3) · copper wire bonding (1) · crack (1) · cross-sectioning (1) · CT (1) · curing (2) · data collection (1) · DC motor control (1) · deep learning (1) · design of experiments (1) · destructive mechanical tests (1) · detection (1) · digital force measurment (1) · direct current motor (1) · EFO time offset (1) · electrochemical impedance spectroscopy (1) · electromigration (1) · electronic manufacturing (1) · ENEPIG (1) · ENIG (1) · ESD protection (1) · ESP32 (1) · ESP-WROOM (1) · expected lifetime (1) · finite element method (2) · firing time (1) · flexible substrate (1) · flexural properties (1) · flip-chip (1) · Fluid simulation (1) · force measurement (1) · forced convection soldering (1) · free air ball diameter (1) · galvanic isolation (1) · hardware design (1) · HAST (1) · head and pillow (1) · heating factor (1) · high temperature life-time test (1) · hole filling (1) · hot air solder leveling (1) · image processing (1) · immersion silver (1) · infrared reflow soldering (1) · instance segmentation (1) · insulation width measurement (1) · intermetallic compound (1) · intermetallic layer (4) · intermetallic layer growth (1) · isotropic (1) · isotropic conductive adhesive (1) · laser trimming (1) · layer thickness measurement (1) · leaded and lead-free solder alloys (1) · lead-free solder (1) · lead-free solder alloys (1) · Lean guidelines (1) · LGA (2) · liquid surface model (1) · liquid surface modelling (1) · log-in system (1) · machine vision (1) · Matlab (1) · Matlab Image Processing (1) · measurement uncertainty (1) · mechanical investigation (1) · mechanical modelling (1) · mechanical properties (1) · mechanical testing (1) · micro wire bonding (1) · micro-alloyed solders (1) · micro-alloying (2) · microcontroller control (1) · microcontroller programming (1) · miniwave (1) · morphology (1) · nanoparticles (1) · NeuroMEMS (1) · numeric simulation (1) · numerical model validation (1) · OMRON FH (1) · optical detection (1) · optical inspection (1) · parameter optimization (1) · particle structure (1) · PCB properties (1) · Pin-in-Paste (1) · PiP (1) · PLA-based circuit subsstrates (1) · placement position offsets (1) · platings (1) · polylactic acid (1) · polymer substrate (1) · Printed circuit board (1) · printed circuit board substrate (2) · printed wiring board (2) · printing property (1) · Process Capability (1) · production line data colletion (1) · Production line model (1) · production line tracking (1) · production of stencils (1) · QFN package (1) · quantitve metallography (2) · reflow soldering (6) · reliability (2) · reliability inspection (1) · Reliability investigation (1) · resistance (1) · resistance measurement (1) · resistor (1) · RFID (1) · rheological (1) · rheology (2) · scanning acoustic microscopy (1) · scanning electron microscope (3) · semiconductor technology (1) · Shape properties (1) · shear strength (6) · shear strength measurement (2) · shear test (1) · silver content (1) · skeletonization (1) · SMT production (1) · SMT production line (1) · Sn3.5Ag (1) · software developing (1) · solder alloys (1) · solder joint (3) · solder paste (5) · solder profile (1) · soldered joints (1) · soldered joints defects (1) · soldering (4) · stationary state (1) · stencil printing (5) · structure of stencils (1) · Surface Evolver (2) · suspension (1) · termosonic bonding (1) · Test Environment (1) · testing of stencils (1) · thermal shock (3) · thermosonic (1) · thermosonic bonding (1) · thermosonic gold micro-wire bonding (1) · thermosonic wire bonding (1) · thermosonic wire-bonding (1) · thick film technology (1) · thick-film (1) · thixotropic behaviour (1) · three-point bending (4) · tin whisker (1) · tombstone-effect (2) · trace width measurement (1) · ultrasonic (1) · ultrasonic chip bonding technology (1) · vacuum soldering (1) · vapor phase soldering (1) · vapour phase soldering (6) · viscosity (2) · voids (1) · volume calculation (1) · wafer bonding (1) · wafer dicing (1) · wedge bond (1) · wetting balance (1) · wetting properties (1) · X-ray effect on semiconductors (1) · YOLO algorithm (1)
56 theses in total. View all theses »